FREMONT, Calif., February 24, 2023 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) ACMR, a leading provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced that it has received an initial tool order for its Ultra C SAPS-V cleaning tool from a major Europe-based global semiconductor manufacturer. The tool is expected to ship to the potential customer’s European facility in Q4 2023.

“We are pleased to continue advancing ACM’s mission to become a supplier to major global semiconductor manufacturers,” said Dr. David Wang, President and Chief Executive Officer of ACM Research. “With the scaling of our business in mainland China and the ongoing evaluation at a major US manufacturer, we are beginning to see traction for our SAPS technology in the European market. Receiving our first tooling order in Europe is a testament to the strength of our technology and the efforts of our sales team. We are optimistic that success with this tool can lead to repeat business with this client, as well as new opportunities with other major clients in the region.”

Via the SAPS tool

ACM’s proprietary Space Alternated Phase Shift (SAPS) advanced wafer cleaning technology uses alternating phases of megasonic waves in the gap between a megasonic transducer and the wafer. Unlike the stationary megasonic transducers used in previous generations of megasonic wafer cleaning systems, SAPS technology moves or tilts the transducer as the wafer rotates, delivering megasonic energy evenly across all points on the wafer, even when the wafer is spinning is warped. SAPS is a faster process than traditional megasonic cleaning and does not cause material loss or create a rough wafer surface. SAPS achieves a deeper, more comprehensive cleaning and has been demonstrated for 1xnm DRAM devices and beyond.

About ACM Research, Inc.

ACM develops, manufactures and sells semiconductor process equipment for single-wafer or…